The future of high-scale networking isn’t just arriving; it’s officially ready for your rack. We are excited to announce that the Celestica DS6000 series switches have moved from the cutting edge of development to shipping status, providing the backbone needed for the next generation of data center evolution. To celebrate this milestone, the Celestica team is heading to the OCP EMEA Summit in Barcelona, where we’ll be showcasing the DS6001 - our 2OU, 64x 1.6TbE, liquid-cooled, ORV3 switch - in person. Beyond the hardware, we’re diving deep into the industry's most pressing challenges – our featured speakers will be taking the stage to lead critical discussions on the shift to 1.6T bandwidth, the infrastructure demands of generative AI, and the continued maturation of the SONiC ecosystem.
Our 1.6T Series is Here
The Celestica 1.6T-based ‘DS6000 Series’ - with both an air-cooled and hybrid liquid cooled version - isn't just a step forward, it’s a leap into a new era of high-performance networking. Powered by the industry-leading Broadcom Tomahawk 6 (TH6) switch silicon, the DS6000 series delivers a staggering 102.4 Tbps of non-blocking switching capacity. This massive throughput is designed to eliminate the bottlenecks common in massive AI/ML training clusters, where every millisecond of latency counts.
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Built with the future of the open-source ecosystem in mind, the DS6000 series offers unparalleled density and efficiency:
- 1.6T Connectivity: Featuring 64 ports of 1.6TbE (OSFP224), the DS6000 provides the highest bandwidth density available today, with flexible breakout options ranging from 50G to 800G.
- Advanced AI Routing: Leveraging Broadcom’s Cognitive Routing 2.0, the series is optimized for both scale-up and scale-out network topologies, ensuring reliable performance for frontier AI models.
- Scaling XPU Clusters: Ultra Ethernet Consortium (UEC) and Open-Compute Project (OCP) Ethernet Scale-Up Networking (ESUN) standards compliant support for interconnecting rackscale XPU clusters.
- Energy-Aware Design: To tackle the rising thermal demands of modern data centers, the DS6000 utilizes 224G SerDes technology and support for Linear Pluggable Optics (LPO), significantly reducing power consumption per bit.
- Form Factor Versatility: Whether you need the traditional air-cooled 3RU DS6000 for standard 19-inch racks or the hybrid-cooled 2OU DS6001 for 21-inch OCP ORv3 environments, we provide the hardware flexibility to match your specific cooling infrastructure.
By integrating enterprise-class reliability with the cost-efficiencies of open networking (ONIE and SONiC), the DS6000 series is the definitive choice for organizations ready to future-proof their AI fabrics. The DS6000-series is ready to order, with testing samples available now!
SONiC Makes the Difference
Celestica’s core advantage is the battle-tested integration of SONiC across our portfolio, offering a unified, scalable stack from edge to core. We provide a "hardened" SONiC experience, merging open-source flexibility with enterprise-grade stability and global support. By optimizing SONiC for Broadcom TH6 silicon, we deliver a future-proof AI fabric that ensures seamless orchestration and zero vendor lock-in for mission-critical workloads.
Hear from the Experts
To highlight the expertise Celestica is bringing to the OCP EMEA Summit this April, here is a look at our featured speakers and the cutting-edge topics they will be covering:
- Removing the Bottleneck: Building Scalable Infrastructure for the Generative AI Era, Matt Roman (Celestica), Wed. April 29, 13:54pm – 14:09pm
- Open Compute Project Reference Architectures for AI Training and Inference, Matt Roman (& Panel), Thurs. April 30, 11:30-12:00pm
- Streamlined Monitoring and Analytics for AI and Enterprise SONiC Deployments, Arun Soletti & Bartek Raszczyk (Celestica), Thurs. April 30, 14:00-14:30pm
- High-Performance AI Fabrics Built on Open Standards: Scaling 800G and 1.6T Infrastructures, Arun Soletti (Celestica) & Art Fewell (Hedgehog), Thurs. April 30, 15:25-15:40pm
Beyond the Hardware: End-to-End Lifecycle Services
Delivering a 102.4T milestone requires more than just leading-edge silicon. To help our customers navigate the complexities of 1.6T deployment, Celestica offers a comprehensive suite of IT Lifecycle Services. From custom rack integration and validation to technical support, we ensure your infrastructure is not only "ready-to-order" but ready to perform from day one. Our goal is to simplify the path to AI-scale networking, empowering you to focus on innovation while we handle the operational heavy lifting.
Ready to Discuss Your Infrastructure Needs?
If you're attending the OCP EMEA Summit, in Barcelona, Spain, April 29-30, visit our event landing page to learn how Celestica’s engineering leadership is shaping the future of the open compute landscape. Be sure to mark your calendars!